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Technical Support Specialist

Date Posted: Oct 09, 2026

Job Detail

  • location_on
    Location Bengaluru, Karnataka, India
  • desktop_windows
    Job Type: Full Time/Permanent
  • schedule
    Shift:
  • analytics
    Career Level:
  • group
    Positions:
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    Experience:
  • male
    Gender: No Preference
  • school
    Degree:
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    Apply Before: Dec 07, 2026

Job Description

Job Summary

HCLTech is seeking an experienced ATMP Equipment SME to support the growth of its OSAT/ATMP Equipment Engineering business. The individual will serve as a subject matter expert for backend semiconductor manufacturing and advanced packaging technologies, supporting customer engagements, solution development, delivery excellence, and capability building across semiconductor manufacturing programs.

Key Responsibilities

  • Act as the technical SME for OSAT/ATMP equipment engineering opportunities.
  • Support customer discussions, technical workshops, proposals, RFIs, RFQs, and solution development.
  • Prvide domain expertise for equipment installation, qualification, acceptance testing, and sustaining engineering activities.
  • Support advanced packaging and backend manufacturing programs for global semiconductor customers.
  • Develop reusable assets, deployment methodologies, SOPs, and best practices.
  • Mentor engineers and support competency development within the Semiconductor Manufacturing organization.
  • Work closely with OEMs, customers, delivery teams, and ecosystem partners to resolve technical challenges.
  • Support the development of managed services and multi-shift delivery models for ATMP equipment support.

Skill Requirements

  • 8-12 years of experience in Semiconductor Manufacturing, OSAT, ATMP, or Equipment Engineering.
  • Strong expertise in Die Attach, Wire Bond, Flip Chip, Molding, Dicing, Test Equipment, or Handlers.
  • Experience in equipment installation, qualification, troubleshooting, maintenance, and production ramp support.
  • Strong understanding of semiconductor packaging and assembly processes.
  • Customer-facing experience with strong communication and stakeholder management skills.

Other Requirements

  • Experience in 2.5D/3D Packaging, Fan-Out Packaging, TCB, Hybrid Bonding, and HBM Packaging.
  • Experience with ASMPT, K&S, Besi, DISCO, Advantest, or Teradyne equipment platforms.
    Exposure to Greenfield OSAT/ATMP setup and commissioning.
  • Experience supporting high-volume manufacturing environments.

Source: HCLTech careers — Read the original posting and apply

This role is listed by the employer on its own careers site. Kaam Ki Khoj does not process applications for it.

Company Overview

HCLTech
HCLTech · Noida, Uttar Pradesh, India
4,246 open roles

HCLTech is an employer in the IT/Computers - Software, Software Services sector with operations in India. This is a directory listing maintained by Kaam Ki Khoj so that candidates can find the organisation; it is not an official company page and Kaam... Read More

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