Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.
The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.
Apple products are as beautiful on the inside as they are on the outside. Inside every one of our products, are some of the world's most challenging consumer PCBA and Flex designs. Imagine yourself as a select member of the team that brings these assemblies from concept to high volume manufacturing.
In this highly visible role, you will have the opportunity to make a significant impact on Apple Products, and leave a footprint for years to come. We have an opportunity for an accomplished PCBA DFM engineer to lead the development, and ramp for a next generation Apple product.
Our PCBA DFM engineering team enables the mass creation of impossible products as a partner in the development of Apple's renowned designs.
BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
5+ years of experience in printed circuit assembly manufacturing processes.
Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
Travel domestically and internationally to supplier sites – 60%
Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
Experience with the development and evaluation of various SMT processes
Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
Good team player with an ability to work with multiple x-functional teams
Source: Apple careers — Read the original posting and apply
This role is listed by the employer on its own careers site. Kaam Ki Khoj does not process applications for it.
Apple openings shown on Kaam Ki Khoj are read directly from the company's own careers site and link back to it. Apply there; Kaam Ki Khoj does not process applications for these roles and is not affiliated with Apple. Read More
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